| abstract |
The present invention provides an insulating resin composition for a printed circuit board, a prepreg using the same, a copper-clad laminate, and a printed circuit board. More specifically, the present invention has the effect of improving the heat resistance characteristics of the glass transition temperature and the thermal expansion coefficient and improving the mechanical properties of the peeling strength between the metal layer and the insulating layer by including a curing agent containing a bipyridine structure in the insulating resin composition . |