abstract |
A polishing composition capable of sufficiently maintaining a high polishing rate for a barrier layer and an insulating film, sufficiently suppressing a polishing rate of a low dielectric constant material, and preventing agglomeration of abrasive grains is provided. The present invention is a polishing composition used for polishing an object to be polished having a barrier layer, a metal wiring layer and an insulating film, and is a polishing composition comprising an oxidizing agent and a nonionic compound having a weight average molecular weight of 1000 or less. |