| abstract |
The present invention relates to a photosensitive resin composition comprising (1) a structural unit derived from (1-1) an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated carboxylic acid anhydride, or a mixture thereof, and (1-2) A copolymer comprising a constituent unit derived from an unsaturated compound; (2) a compound of the formula (1), a compound of the formula (2), or a mixture thereof; And (3) the photopolymerizable composition of the present invention comprising a photopolymerization initiator exhibits an excellent residual film ratio, sensitivity and pattern developability at the time of forming a cured film, and the cured film produced therefrom has excellent chemical resistance (chemical resistance) And heat resistance, it can be usefully used in the production of insulating films for liquid crystal display devices. |