| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_088675cb8ace631a2a6888a708e0b386 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2014-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4bdecda337e6cab9370c7b79ddb3a38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42a162e997a41ff21bd51457ad372ee7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6dd69a844932ebf62f0e64f578af3dba |
| publicationDate |
2015-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150048052-A |
| titleOfInvention |
Electronic device and method of manufacturing electronic device |
| abstract |
(PROBLEMS TO BE SOLVED) To provide an electronic device that prevents penetration of a penetrating electrode by preventing the penetration of moisture, and enables stress relaxation to the base substrate. An electronic device of the present invention includes: an insulating base substrate having a plurality of through electrodes formed thereon; an electronic device electrically connected to the through electrode and mounted on one surface of the base substrate; And an outer electrode covering the end surface of the penetrating electrode exposed on the other surface of the base substrate to the other surface around the end surface of the base substrate, Wherein the external electrode includes a conductive film covering from the end face to the other surface around the cross section, a first electrolytic plating film formed on the surface of the conductive film by an electrolytic plating method, And a second electroplated film formed on the surface of the electroplated film by electrolytic plating, and the second electroplated film is made of tin or a tin alloy As shown in FIG. |
| priorityDate |
2013-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |