| abstract |
[PROBLEMS] To provide a heat curing type conductive silicone composition which is excellent in adhesive strength and workability and which gives a cured product having heat resistance, light resistance and crack resistance. (A) An organopolysiloxane having at least one structure represented by the following general formula (1) in a molecule, [Chemical Formula 1] Wherein R 1 is a hydrogen atom, a phenyl group or a halogenated phenyl group, R 2 is a hydrogen atom or a methyl group, R 3 is a substituted or unsubstituted, and the same or different, Z 1 is -R 4 -, -R 4 -O-, -R 4 (CH 3 ) 2 Si-O- (wherein R 4 is substituted or unsubstituted and may be the same or different And Z 2 is an oxygen atom or a substituted or unsubstituted divalent organic group having 1 to 10 carbon atoms which may be the same or different.] (B) an organic peroxide, and (C) conductive particles. |