| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-18 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-0073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-0084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18 |
| filingDate |
2008-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150038691-A |
| titleOfInvention |
New antioxidants for post-cmp cleaning formulations |
| abstract |
The present invention is directed to a cleaning composition and method for cleaning residues and contaminants after CMP from a microelectronic device having residues and contaminants thereon after chemical mechanical polishing (CMP). The composition highly achieves effective cleaning of residues and contaminants after CMP from the surface of the microelectronic device without damaging the low-k dielectric material or the copper interconnect material. |
| priorityDate |
2007-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |