http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150014685-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-62 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate | 2013-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20150014685-A |
| titleOfInvention | Plating solution containing Au-Pd alloy for manufacturing PPF plating-layer of semiconductor leadframe |
| abstract | The present invention discloses an ultra thin gold-palladium alloy plating solution for forming a PPF plating layer of a semiconductor lead frame. An ultra-thin gold-palladium alloy plating solution for forming a PPF plating layer of a semiconductor lead frame according to the present invention is a plating solution for forming a plating layer on the surface of a lead frame of a semiconductor manufacturing process, wherein the plating solution is potassium gold (I) cyanide (I) cyanide, potassium (III) cyanide, gold (III) chloride hydrate and sodium gold sulfite. Palladium (II) acetate, Palladium (II) nitrate, and Palladium (II) acetate, and the like. (II) cyanide). According to this feature, it is possible to provide a resin composition which is excellent in adhesion, corrosion resistance And the wirebondability characteristic can be ensured to improve the manufacturing efficiency of the semiconductor process. |
| priorityDate | 2013-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 89.