| abstract |
Micro Electro Mechanical systems (MEMS) devices include CMOS-MEMS dies including solder bumps, CMOS dies, and MEMS dies on a substrate, and stud bumps on the CMOS die. The MEMS die is positioned between the CMOS die and the substrate. The stud bumps and the solder bumps are arranged to provide electrical connection between the CMOS die and the substrate. |