| abstract |
The present invention relates to a wire comprising a copper core (2) having a surface and a coating layer (3), preferably a bonding wire in microelectronics, wherein the coating layer (3) is superimposed on the surface of the core , The coating layer 3 comprises aluminum and the area share of the coating layer 3 in the cross-section of the wire is in the range of 20 to 50% based on the total area of the wire cross-section, The aspect ratio between the longest path leading to the shortest path and the shortest path is in the range of more than 0.8 to 1.0, and the wire has a diameter in the range of 100 탆 to 600 탆. The present invention also relates to a method of manufacturing a wire, a wire obtainable by the method, an electric device comprising at least two elements and at least the aforementioned wire, a propulsion device comprising the electric device, Lt; RTI ID = 0.0 > wires. ≪ / RTI > |