| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2014-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3440af9827a5f83cce0a496884f5dd52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81d5f788bb1f23bdbaeb74c8d074649a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d0d78451b823acf2a8bdd86538acdca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6bc085edf716bfcae636c60e2d8a91b |
| publicationDate |
2015-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150010647-A |
| titleOfInvention |
Heat-peelable pressure-sensitive adhesive tape and cutting method of electronic components |
| abstract |
A heat-peelable adhesive tape for cutting an electronic component and a method for cutting an electronic component using the heat-peelable adhesive tape, characterized in that the heat-peelable adhesive tape has sufficient retentivity at the time of cutting an electronic component, . (The immersion speed: 30 mm / min, the test speed: 30 mm / min, the preload: 100 gf, and the compression time: 1.0 sec) of the thermally expandable pressure-sensitive adhesive layer is the heat peelable pressure- A heat peelable adhesive tape of 60 N / 5 mmφ or more. |
| priorityDate |
2013-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |