| abstract |
(A) an organopolysiloxane having a kinematic viscosity at 25 DEG C of 5,000 to 100,000 mm < 2 > / s and having at least two alkenyl groups in a molecule, (B) (R 1 is an alkyl group having 1 to 6 carbon atoms and a is an integer of 5 to 100), (C) a thermally conductive filler having a thermal conductivity of 10 W / m · 캜 or more , (D) an organohydrogenpolysiloxane containing hydrogen atoms (Si-H groups) directly connected to at least 2 but no more than 5 silicon atoms in one molecule, (E) a triazine ring and at least one alkenyl And (F) a catalyst selected from the group consisting of platinum and a platinum compound. The thermally conductive silicone grease composition of the present invention has a reduced increase in hardness during heating at a high temperature and suppresses reduction in elongation. |