| abstract |
An epoxy resin composition useful as a laminated material, a semiconductor encapsulant, a molding material, a powder coating material, and an adhesive material is provided which exhibits excellent low dielectric properties and exhibits excellent flame retardancy in a non-halogen system. Wherein the epoxy resin component comprises a styrene-modified epoxy resin represented by the following general formula (1) and a phosphorus-containing epoxy resin having a phosphorus content of 1.0 to 5.0% by weight, wherein the content of the epoxy resin represented by the general formula (1) The epoxy resin composition according to any one of claims 1 to 3, wherein the total amount of the epoxy resin is 30% by weight or more. (Wherein G is a glycidyl group, R 1 and R 3 are hydrogen or a hydrocarbon group, R 2 is a substituent represented by the formula (a), n is 1 to 20, and p is 0.1 to 2.5.) |