| abstract |
A circuit connecting material having excellent low temperature curing properties and a method for producing a mounting body using the same are provided. A two-layer structure in which a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, a first adhesive layer containing conductive particles, a cationic polymerizable resin, and a second adhesive layer containing a cationic polymerization initiator . Thereby, even when compressed at a low temperature, a high trapping efficiency of the conductive particles can be obtained and the low temperature curability is improved. |