http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140143841-A

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filingDate 2013-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80cb9aa215242037aaccafaea0cb55ab
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publicationDate 2014-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20140143841-A
titleOfInvention Aspect ratio dependent deposition to improve gate spacer profile, fin-loss and hardmask-loss for finfet scheme
abstract The techniques disclosed herein include systems and methods for an aspect ratio dependent film deposition process that improves the gate spacer profile in FinFET or other transistor schemes and reduces pin loss and also reduces hard mask loss. This technique involves the deposition of an aspect ratio dependent protective layer to assist in profile adjustment of the structure during fabrication. Plasma and process gas parameters are adjusted so that a greater amount of polymer can be captured on the surface of the structure visible to the plasma. For example, the upper portion of the structure can capture a greater amount of polymer than the lower portion of the structure. The variable thickness of the protective layer allows selective portions of the spacer material to be removed while other portions are protected.
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Total number of triples: 46.