| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2400-143 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
| filingDate |
2014-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_285883e27d75ced51105c333c871e3f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4832c29ddc709d37831d79008cc6b24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac4ef1fa19d5880f281b6d2eb39f11db |
| publicationDate |
2014-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140143084-A |
| titleOfInvention |
Adhesive material for semiconductor process |
| abstract |
The present invention relates to an adhesive material for a manufacturing process of a semiconductor used for fixing or protecting a wafer forming a device in the manufacturing process of the semiconductor. An existing adhesive material has problems of bending or damage of a semiconductor wafer caused by dimensional change of the adhesive material. The present invention uses a sheet obtained by impregnating a curable resin (A) on glass fiber (B) as a base material for the adhesive material. The base material has high dimensional stability and can inhibit bending of the semiconductor wafer in the process. |
| priorityDate |
2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |