http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140142406-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_feebe14d91567473ffcb2b440e2c3f13 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D213-72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F1-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01G3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D213-72 |
| filingDate | 2013-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11c3791540d36bbe1c735a9421913df6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cf40d1096bee2a3ba7947aadd918b85 |
| publicationDate | 2014-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20140142406-A |
| titleOfInvention | ink composition for using organic copper precursor and manufacturing method thereof |
| abstract | The organic copper precursor of the present invention is prepared by synthesizing an organometallic precursor in which a copper compound containing nitrogen, oxygen, sulfur or the like is coordinated to a heterocyclic compound as a central metal, and mixing the resultant with a surfactant and a dissolving agent. The present invention relates to a copper precursor, an ink composition using the copper precursor, and a manufacturing method thereof. The organic copper precursor having the above-described structure, the ink composition using the same, and the method of manufacturing the same can collect and recycle the gas generated when the organic copper precursor is sintered, and have been conventionally manufactured by an etching process using a photoresist Printed circuit boards (PCBs) are processed in a continuous process at a low temperature within three steps, which improves productivity and simplifies processes as well as reduces the amount of chemical wastewater generated in existing processes by shortening processes. Which is advantageous in that it has an economically excellent effect. The ink composition containing the organic copper precursor is applied to the film in a predetermined pattern form and then subjected to heat treatment to obtain a film having a high linear copper pattern with a high line width and a high specific conductivity of 2 μΩ · cm or less It can be characterized. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10954406-B2 |
| priorityDate | 2013-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 98.