abstract |
According to the present invention, there is provided a resin composition for encapsulating an electronic part, which comprises a phenol resin curing agent and an epoxy resin, wherein the phenolic resin curing agent and the epoxy resin each have a biphenyl structure, a phenolic resin curing agent and an epoxy resin , A cured product having a glass transition temperature of 200 DEG C or more and a weight loss rate of 0.3% or less, and an electronic device sealed with the resin composition. |