http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140129342-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_646018b7183a929bbb6e26dcdb62a8da |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-0525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02T10-70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-661 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-665 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-44 |
| filingDate | 2013-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ee1961441fb163b5af509622d73d4fe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_beeef9bdb66c1a00b1b2bb93cafd60c7 |
| publicationDate | 2014-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20140129342-A |
| titleOfInvention | Method for preparing low-melting-point plating solution for electrical aluminum plating, plating solution for electrical aluminum plating, method for producing aluminum foil, and method for lowering melting point of plating solution for electrical aluminum plating |
| abstract | The present invention relates to a process for preparing a plating solution containing at least a dialkylsulfone, an aluminum halide and a nitrogen-containing compound when adjusting a plating solution containing at least a dialkylsulfone, (2) an aluminum halide, and (3) , The aluminum halide is 3.5 + n to 4.2 + n mol, and the nitrogen compound is n mol (where n is 0.001 to 2.0 mol) relative to 10 mol of the dialkylsulfone. In addition, the electroplating solution for electric aluminum plating adjusted by the method of the present invention has an advantage of being able to perform an electroplating process with high aluminum deposition efficiency with respect to the amount of electricity, thereby reducing the amount of electricity used and thus being excellent in economy. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160149522-A |
| priorityDate | 2012-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.