Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8d0fc2b70675ee19bd5fc464f5ae9061 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3006 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-30 |
filingDate |
2013-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bb6a89bf2f394a1124799c62304df54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6399f68d1b5fb5d09d970b1e460342c6 |
publicationDate |
2014-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20140127107-A |
titleOfInvention |
Lead-free nano solder of controllable melting point |
abstract |
The lead-free nano-solder includes nanoparticles of silver (Ag) satisfying the following formula. Here, the expression is expressed as follows. Where T E is the process temperature and C E is the wt% of Ag. |
priorityDate |
2013-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |