| abstract |
Embodiments of the present invention are directed to techniques and configurations for a hybrid carbon-metal interconnect structure in an integrated circuit assembly. In one embodiment, the apparatus comprises a substrate, a metal interconnect layer disposed over the substrate and configured to act as a growth initiation layer for the graphene layer; And a graphene layer, wherein the graphene layer is formed directly over the metal interconnect layer, and wherein the metal interconnect layer and the graphene layer are configured to route the electrical signal. Other embodiments may be described and / or claimed. |