abstract |
The epoxy resin curing composition proposed in the present invention includes a cycloaliphatic epoxy resin, an aromatic diamine curing agent, and a strong acid salt catalyst. The epoxy resin curing composition has a viscosity of 500 to 1,500 cps at room temperature, a tensile elongation after curing of 1.8% or more, and a glass transition temperature of 200 ° C or more. According to the present invention, it is possible to mass-produce a resin applicable to processes such as filament winding, because it has a lower viscosity and a higher heat resistance than conventional epoxy resin curing compositions having heat resistance. |