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publicationDate 2014-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20140113265-A
titleOfInvention Integrate rinse module in hybrid bonding platform
abstract The method includes performing a plasma activation on the surface of the first package component, removing the oxide region from the surface of the metal pad of the first package component, and pre-bonding pre-bonding &lt; / RTI &gt;
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