http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140112405-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2014-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cd211457d06b5eb48ba77b9d06b22f7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a633fd9616df953cb80d71f5b70943b |
| publicationDate | 2014-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20140112405-A |
| titleOfInvention | Method for manufacturing multilayer printed wiring board and composite containing prepreg with carrier metal foil using the same |
| abstract | A process for producing a multilayer printed wiring board characterized by comprising the following steps (A) to (D): (A) preparing a composite material containing a carrier metal foil having a laminate structure of a support / prepreg / copper alloy plating layer / carrier metal foil, (B) peeling the support of the composite material containing a carrier metal foil, (C) a step of curing the prepreg to form an insulating layer, and (D) a step of peeling the carrier metal foil. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023277462-A1 |
| priorityDate | 2013-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 144.