| abstract |
A single mask package device on a device is disclosed herein and includes a first substrate having a land disposed on a first surface, a stud disposed on the land, and a second mask disposed on the first surface of the first substrate, As shown in FIG. The protective layer may optionally have a thickness of at least 3 [mu] m. The PPI can be placed over the protective layer and in electrical contact with the stud, and the first portion of the PPI extends laterally from the stud. The interconnect portion is disposed on the first portion of the PPI and is in electrical contact with the first portion of the PPI, and the second substrate is mounted on the interconnect portion. Molding compounds can be placed over the PPI and around the interconnect. The stud may be a solid material having a substantially cylindrical cross-section and may optionally be wire-bonded to the land. |