| abstract |
The present invention relates to a photo-curable resin composition which is excellent in adhesiveness and flexibility with a substrate, has a low incidence of cracking and warpage of the cured product and can be developed by an aqueous alkali solution having excellent resolution, its photocurable dry film, And a printed wiring board comprising the same. A photocurable resin composition comprising (A) an alkali-soluble resin, (B) a photopolymerization initiator, and (C) a spherical silica filler having an average particle size of 300 nm or less, wherein the amount of the spherical silica filler (C) Curable resin composition, a photocurable dry film thereof, a cured product thereof, and a printed wiring board containing the same, wherein the amount of the photocurable resin composition is 60% by mass or more based on the total amount of the photocurable resin composition. |