| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B62D65-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B62D65-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate |
2014-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ce26b92aa1a74d4ec37df4e882360e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32740714f45889c006c653c2b81b8322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_768eda2a2562f2f735e00971b2d425b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b369d78a4da0701f9329db7e5b1248a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f77eba0c5db6899eaaf8c2c569ca8e6f |
| publicationDate |
2014-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140108113-A |
| titleOfInvention |
Method for forming metal film, conductive ink used in the method, multilayer wiring board, semiconductor substrate, and capacitor cell |
| abstract |
An object of the present invention is to provide a method of forming a metal film on a surface of a substrate having a hole, which can easily form a metal film on a surface of the substrate in contact with the hole with a simple method. (Solution) A method for forming a metal film, comprising the step of heating the substrate with a conductive ink containing a metal salt and a reducing agent in contact with a surface of the substrate having the hole, the surface being in contact with the hole. |
| priorityDate |
2013-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |