| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33b011e77b33662b8bf1f2ff2de7b661 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-168
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 |
| filingDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5aedf739163466bde47526096dd5dac3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec745ca65cd6beb0ea9f71099c7d6ab5 |
| publicationDate |
2014-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140106718-A |
| titleOfInvention |
Ink composition for making a conductive silver structure |
| abstract |
An ink composition for producing a conductive silver structure, according to one embodiment, is a silver salt; And complexes of (a) complexing agents and short-chain carboxylic acids or (b) complexing agents and short-chain carboxylic acid salts. The method for preparing a silver structure comprises the steps of: combining a silver salt with a complexing agent; And adding a short chain carboxylic acid or a short chain carboxylic acid salt to the combined silver salt and complexing agent to form an ink composition. Reducing the concentration of the complexing agent in the ink composition to form a concentrated formulation and reducing the silver salt to form a silver structure and the concentrated formulation and conductive silver structure is formed at a temperature of about 120 ° C or less. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190066436-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180011570-A |
| priorityDate |
2011-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |