http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140105157-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8d0fc2b70675ee19bd5fc464f5ae9061
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-448
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44
filingDate 2013-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e8f55d502fb86ae3b22326cb1e396bb
publicationDate 2014-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20140105157-A
titleOfInvention Selective atomic layer deposition apparatus and method
abstract The present invention discloses a selective atomic layer deposition method and apparatus. According to the present invention, there is provided a method of selective atomic layer deposition comprising: forming a pattern with a conductor material on a substrate; Applying a current to the pattern to generate resistance heat; And depositing a thin film on the pattern or in an area other than the pattern by implanting a source gas of the precursor and the reactant, wherein the deposition area of the thin film is determined by the temperature of the pattern through the resistive heat A selective atomic layer deposition method is provided.
priorityDate 2013-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 17.