| abstract |
In some embodiments, the printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further includes a plurality of conductive tracks coupled to at least one surface of the substrate. The PCB further comprises a multilayer coating deposited on at least one surface of the substrate. The multilayer coating includes (i) at least a portion of a plurality of conductive tracks, and (ii) at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical element connected by solder bonding to the at least one conductive track, wherein the solder joint is soldered through the multilayer so that the solder joint is adjacent the multilayer coating. |