| abstract |
A Sb-Te-based sintered material sputtering target containing carbon or boron in an amount of 0.1 to 30 at%, comprising Sb-Te based alloy particles and fine carbon (C) or boron (B) Wherein the Sb-Te based alloy particles have an average crystal grain size of 3 占 퐉 or less, a standard deviation of less than 1.00, an average grain size of C or B of 0.5 占 퐉 or less and a standard deviation of less than 0.20, A Sb-Te based alloy sintered product sputtering target comprising Sb and Te as main components, wherein Y / X is in the range of 0.1 to 0.5 when the particle diameter is X, and the average particle diameter of carbon or boron is Y. Sb-Te-based alloy sputtering Improves the target structure, suppresses cracking of the sintered target, and prevents occurrence of arcing during sputtering. |