| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_faa5b9d292a113e1e92b0bb040d9da8d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_49b1d97f019b903768d881b20eed9825 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-421
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 |
| filingDate |
2014-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa634e2ee4e9c12b80f9df5928303cfc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34ad31af018b070db986153fab0dae2d |
| publicationDate |
2014-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140094473-A |
| titleOfInvention |
Thermally conductive resin composition and molded body |
| abstract |
An object of the present invention is to provide a thermoplastic resin composition which is excellent in molding workability even though it contains a large amount of thermally conductive particles and is excellent in smoothness when extruded, And a molded article obtained by molding the thermally conductive resin composition. The thermally conductive resin composition according to the present invention is a thermally conductive resin composition obtained by the above method. [MEANS FOR SOLVING PROBLEMS] The thermally conductive resin composition of the present invention comprises thermally conductive particles having an average primary particle diameter of 0.1 to 30 μm and a thermoplastic resin, the thermally conductive particles having magnesium carbonate particles and a coating layer, and the coating layer is an alkoxysilyl And a surface treating agent having an alkyl group. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102541617-B1 |
| priorityDate |
2013-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |