| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a749dd13418c65595b4495150416ddb5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fec1a24d16fa7bc73da38a50da3806d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1632e5f6cb158d2c3b9cbb43c23eaff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37c611d1422c406d02435d7a1eb95b9f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a884957d9ac21a7b75c43f45b41b124a |
| publicationDate |
2014-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140089303-A |
| titleOfInvention |
Silver paste for manufacturing flexible printed circuit board and flexible printed circuit board |
| abstract |
The present invention relates to a silver paste for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured using the same. The silver paste contains 73wt% to 88wt% of silver powder, 5.9wt% to 9.5wt% of polymer resin, 5.7wt% to 18.0wt% The manufacturing cost of the flexible printed circuit board can be reduced by simplifying and facilitating the process of etching the copper foil of the existing expensive FCCL by printing the circuit pattern on the substrate and fabricating the flexible printed circuit board by low temperature firing And improve productivity. |
| priorityDate |
2012-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |