http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140082525-A

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filingDate 2012-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_003f884877103a5656a7911a6619e490
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5fa2238effef3a0b275af64194d9dfd
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publicationDate 2014-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20140082525-A
titleOfInvention Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same
abstract An epoxy resin composition for semiconductor device encapsulation according to the present invention comprises: (A) an epoxy resin comprising a repeating unit represented by the following formula (1) and (2); (B) a curing agent; (C) a curing accelerator; And (D) an inorganic filler, and is excellent in bending properties, adhesiveness and reliability, and can have excellent flame retardancy without using a halogen-based flame retardant. [Chemical Formula 1] Wherein R 1, R 2, R 3, R 4, R 5 and R 6 are independently hydrogen or a linear or branched alkyl group having 1 to 5 carbon atoms, a and b are each an integer of 0 to 3, c and d are E and f are each an integer of 0 to 5, (2) Wherein R 1, R 2, R 3, R 4, R 5 and R 6 are independently hydrogen or a linear or branched alkyl group of 1 to 5 carbon atoms, a and b are each an integer of 0 to 3, and c, d, e And f are each an integer of 0 to 4).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017099356-A1
priorityDate 2012-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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