| abstract |
The present invention relates to a positive type polyamide varnish capable of developing an alkali and a polyimide film produced by using the positive type polyamide varnish having good solubility in an alkaline developing solution. The polyimide film has a short development time and a low resolution, It is easy. In addition, it has an excellent adhesion (or adhesion) to a Si-containing substrate such as a silicon substrate and is suitable for use as a surface protective film or an interlayer insulating film of a semiconductor device. |