| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2250-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2250-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate |
2012-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b64ea3696ef0d15a77acb56548dfc52 |
| publicationDate |
2014-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140071333-A |
| titleOfInvention |
Copper foil for lamination |
| abstract |
An object of the present invention is to provide a copper foil for attachment which is capable of forming a high-precision wiring pattern while exhibiting good adhesion with a substrate. A mounting copper foil for mounting according to the present invention is a mounting copper foil used for adhering to a substrate, wherein the surface roughness (Rz) of the surface of the mounting side is 0.500 mu m or less and the size of one side of the square box is 1 nm to 10 nm The fractal dimension of the outline of the surface of the side of the copper foil which is adhered to the substrate on the section of the copper foil calculated by the set box counting method is 1.020 to 1.400. |
| priorityDate |
2011-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |