| abstract |
There is provided a semiconductor packaging applicable conductive composition using a coated material flake as a conductive filler, a curable epoxy, an acrylate, a bismaleimide drug, or the like, or a combination thereof as an organic resin, and a process for producing the same. The composition exhibits desirable workability as a distributable die attach adhesive having an appropriate range of rheology, viscosity and physical stability upon storage, is excellent in reliability of conductivity or corrosion resistance, and can reduce the amount of high-cost silver in the composition. |