| abstract |
A resin composition having excellent electrical properties, moisture absorption and heat resistance, and excellent flow characteristics at the time of producing a laminated board, and a prepreg, a metal foil clad laminate and a resin sheet using the resin composition. (B), a bisphenol-type cyanate ester compound (c), an epoxy resin (d), and a brominated (meth) acrylate compound having a polyphenylene ether skeleton and a bifunctional phenylene ether oligomer A resin composition containing a carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol polymerization inhibitor (g) and / or a thioether polymerization inhibitor (h) is used. |