| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 |
| filingDate |
2012-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f0bf9a5f34a12e17d5d8605cef53e83 |
| publicationDate |
2014-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140065373-A |
| titleOfInvention |
Circuit connection material, connection method using same, and connection structure |
| abstract |
Provided is a circuit connecting material capable of exhibiting excellent connection reliability by improving the adhesion between the silicon nitride film and the interface while suppressing the fluctuation of the resistance value between the circuit electrodes when subjected to the high temperature and high humidity treatment. (1) a polyfunctional (meth) acrylate monomer, (2) a polyfunctional (meth) acrylate monomer, and (2) a polyfunctional (meth) acrylate monomer. The circuit connecting material is disposed between a pair of circuit members arranged so that the circuit electrodes face each other, (3) a reactive acrylic polymer having an ethylenic unsaturated group in the side chain and a double bond equivalent of 1000 to 12000. The present invention also provides a circuit connecting material comprising: (a) a curing agent which generates free radicals by heat or light; |
| priorityDate |
2011-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |