| abstract |
A light emitting device according to an embodiment includes: a first lead frame having a first bonding area; A second lead frame spaced apart from the first lead frame and having a second bonding area; A first body coupled to the first and second lead frames, the first and second bonding regions of the first and second lead frames being open; A second body having an opening and disposed on the first body; A gap portion between the first and second lead frames; A light emitting chip having a first connection electrode connected to a first bonding region of the first lead frame, a second connection electrode connected to a second bonding region of the second lead frame, and a plurality of compound semiconductor layers; And a translucent resin layer disposed on the periphery of the light emitting chip, the first body being formed of a material having a higher reflectivity than the transmittance, and the second body having a transmittance And the first and second bonding regions of the first and second lead frames are formed in a region overlapping with the light emitting chip in the vertical direction, . |