| abstract |
The present invention provides a thermosetting resin composition, which is excellent in low warpage property, cold-heat cycle property and the like, and cracking of a coating film in the B-stage state is suppressed, a cured product thereof, and a printed wiring board using the same. The present invention also provides a thermosetting resin composition comprising (A) an epoxy resin, (B) a curing agent for epoxy resin, (C) spherical silicon dioxide and / or spherical aluminum oxide, and (D) Lt; / RTI > |