| abstract |
The epoxy resin composition according to an embodiment is an epoxy resin, and a curing agent and an inorganic filler, said epoxy resin comprises a cyan weapon (-CN) and sulfone (SO 2), wherein the curing agent is an amine group (-NH 2) . A heat radiation circuit board according to an embodiment includes: a metal plate; An insulating layer formed on the metal plate; And a circuit pattern formed on the insulating layer, wherein the insulating layer comprises an epoxy resin containing a cyanide (-CN) and a sulfone (-SO2-), a curing agent containing an amine group (-NH2) And then curing the resulting epoxy resin composition. |