| abstract |
The present invention relates to a positive photosensitive resin composition and a cured film prepared therefrom, wherein at least one compound selected from the group consisting of (A1) a silane compound represented by the formula (1), a hydrolyzate thereof and a condensate of this hydrolyzate, ( A cured film prepared from the photosensitive resin composition of the present invention comprising A2) 1,2-quinonediazide compound, and (A3) an amino silane coupling agent represented by the formula (2) has an adhesive strength to a silicon nitride film (SiN x ) substrate. Not only is it excellent, it has excellent physical properties in terms of pattern developability, heat resistance and light transmittance, and can be usefully used as a protective film of an electronic component. |