http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140049408-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e30a7f3d1fa5dc587c5b5918ce58a332 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0046 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 |
| filingDate | 2012-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62635b413b2b59aab9846a2483254317 |
| publicationDate | 2014-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20140049408-A |
| titleOfInvention | Photosensitive epoxy resin composition for via hole forming and via hole forming method of printed circuit board using same |
| abstract | The present invention relates to a photosensitive epoxy resin composition for forming a via hole containing a photoacid generator and an epoxy resin, and a method of forming a via hole in a printed circuit board using the same. According to the present invention, a photosensitive epoxy resin composition in which a piperidinium salt is introduced as a photoacid generator can be used to form via holes through exposure and development processes. The method of forming a via hole using the photosensitive epoxy resin composition for forming a via hole according to the present invention is advantageous in that the process is simple and the cost can be reduced as compared with the existing technology. In addition, since the method of forming a via hole according to the present invention can maintain the physical properties of the interlayer insulating film, it is possible to solve the disadvantage that inherent properties of epoxy are inhibited in the epoxy resin modification process of the existing technology. In addition, the present invention has an effect of providing a photosensitive epoxy resin composition for forming a via hole in a portion where heat resistance, adhesiveness, chemical resistance, toughness, electrical insulation and the like are required to maintain characteristics inherent to the epoxy resin. |
| priorityDate | 2012-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.