http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140047165-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-062 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14 |
filingDate | 2010-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_900f63be8e14c26ea4525d9032107468 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_debab755bbe7671f2fbe7142d1934cbe |
publicationDate | 2014-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20140047165-A |
titleOfInvention | Photosensitive resin composition, its dry film, and hardened | cured material, and printed wiring board using these |
abstract | The photosensitive resin composition is a photosensitive resin composition which contains at least one acrylamide group or methacrylamide group or at least one acryloyl group or methacryloyl group per molecule in a reaction product obtained by reacting a phenol resin with an alkylene oxide or a cyclocarbonate compound A carboxyl group-containing photosensitive resin obtained by reacting an isocyanate compound with a reaction product obtained by reacting a polybasic acid anhydride, and a photopolymerization initiator. In a preferred embodiment, the composition further comprises a thermosetting component. By using the photosensitive resin composition or the dry film thereof, a cured coating having a PCT resistance, HAST resistance, electroless gold plating resistance, and cold / heat shock resistance as important as a solder resist for a printed wiring board, particularly a semiconductor package can be formed. |
priorityDate | 2009-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 584.