| abstract |
The novel novel compound which is preferable in order to obtain the negative photosensitive resin composition which can form the pattern excellent in adhesiveness by low exposure amount is provided. The compound which concerns on this invention is represented by following formula (1). In formula, R < 1> and R < 2> respectively independently represents a hydrogen atom or an organic group, At least one represents an organic group. R 1 and R 2 may be bonded to each other to form a cyclic structure, or may include a bond of a hetero atom. R 3 represents a single bond or an organic group. Although R < 4> -R < 9> respectively independently represents a hydrogen atom, an organic group, etc., R < 6> and R < 7> do not become a hydroxyl group. R 10 represents a hydrogen atom or an organic group. |