| abstract |
The present invention relates to a photosensitive resin composition, and specifically, by using a polymer that is essentially polymerized by including a monomer capable of imparting a hydrophobic group to a binder polymer, when manufacturing a PCB, workability and circuit characteristics are not deteriorated at the development stage. Disclosed are a photosensitive resin composition capable of suppressing the generation of organic suspended matter called scum, which causes short circuits of a circuit, to improve yield in PCB manufacturing, and a dry film photoresist including the same as a photosensitive layer. |