| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2012-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60d2960526a34411e816a9ce2efad593
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00021caab19c1dcbfeb684015e772b0c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_636dc75b200073c785cb80d9815db56c |
| publicationDate |
2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140037644-A |
| titleOfInvention |
Insulation epoxy resin composition, insulation film, prepreg and printed circuit board |
| abstract |
The present invention is an aqueous solution of LiCl / DMAc cellulose or an aqueous solution of LiCl / DMF cellulose; Liquid crystal oligomers or soluble liquid crystal thermosetting oligomers; Epoxy resin; It provides an insulating epoxy resin composition comprising a, and an inorganic filler; an insulating film, a prepreg and a printed circuit board manufactured using the same. The insulating epoxy resin composition, insulating film, and prepreg of the present invention have low thermal expansion coefficient, high glass transition temperature, and high rigidity. |
| priorityDate |
2012-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |