| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_37f4922dfb7777b019e504b885211b8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f77ee914c98d8113448e74c0e9cda469 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H2245-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-2418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-4697 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-2418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-2406
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-4697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-24 |
| filingDate |
2012-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03dcee35d9029603f7f658ef085e9414
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45a3a68eeb7ba83e01ad4649ee4f9752
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5d88b760eda406eafdfbb42e83d6802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bcca40341cfb19f2df214c10168dec0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bbc1c33e7803c1b80955868a35e8568 |
| publicationDate |
2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140037097-A |
| titleOfInvention |
Plasma Treatment of Substrates |
| abstract |
A method for plasma treating a substrate involves applying a radio frequency high voltage to at least one electrode located in a dielectric housing having an inlet and an outlet, typically allowing a process gas comprising helium to flow from the inlet to the outlet through the electrode, Generating a non-balanced atmospheric plasma. An atomized or gaseous surface treatment agent is incorporated into the non-equilibrium atmospheric plasma. The substrate is positioned adjacent the plasma outlet such that the surface is in contact with the plasma and moved relative to the plasma outlet. The speed of the process gas flowing past the electrode is less than 100 kPa. Process gas is also injected into the dielectric housing at a rate of over 100 kPa. The volume ratio of process gas injected at rates above 100 kPa to process gas flowing past the electrode at less than 100 kPa is from 1:20 to 5: 1. |
| priorityDate |
2011-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |