| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ea0650893830ea9b7b699212d44e6235 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2013-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5fd05718d8ced94794d9f2f51223a0d |
| publicationDate |
2014-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140034695-A |
| titleOfInvention |
Metal foil for heat dissipation, a method of manufacturing the same, a metal foil laminate for heat dissipation including the heat dissipation metal foil and a multilayer printed circuit board |
| abstract |
The present invention relates to a heat dissipating metal foil having excellent heat resistance and adhesive properties, a manufacturing method thereof, a heat dissipating metal foil laminate including the heat dissipating metal foil, and a multilayer printed circuit board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018212563-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101425596-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160120887-A |
| priorityDate |
2012-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |