| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0733 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2012-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecdf4000818e478a53d9041f6e2cee6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b85a2dd260d48facdef58fb581dee30e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8359c4c853057b99bce5c037942e42d |
| publicationDate |
2014-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140033447-A |
| titleOfInvention |
Copper plating method |
| abstract |
A method of copper plating in a plating bath in which a substrate is contacted with a heterocyclic core having a thiol group and a leveler additive comprising an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling groove structures in the manufacture of printed circuit boards, IC substrates and semiconductor substrates. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190099691-A |
| priorityDate |
2011-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |